Almost all electronic gadgets and devices have printed circuit boards as part of the components that constitute them. Manufacturing of PCB is not a difficult process and even amateur electricians can just provide the manufacturer with their own designs in order to get it done. The boards are divided into three categories; multi layer, single and double side boards. Conduction of these boards is usually done using copper, nickel or aluminum based material. The material is chosen depending on how complex or dense the circuits are. Described here is the process followed when going about creating them and the stages involved.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Obtaining alternative resist can be achieved by use of other compounds that are photosensitive or organic. They can be used in their dry or wet forms. When exposed to ultraviolet light, they become hard.
In order to spread the liquid resist, one can use a silk screen, squeegee, roller or spray. One or both sides can have the liquid on. However, application can also be done to a specific area on the surface. Finer circuits can be produced by use of light.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.
The backing is first plated with a conductive material. Holes are then drilled into it in order for conduction to take place in between the layers and also to mount electronic components. The board is then scrubbed to get rid of any small particles of the conductor. Such particles can be later on recycled from the water by using a process such as filtration. Any copper particles left behind can easily mix with other wastes and become pollutant to the environment.
The next step is the cleaning of the board. It is also etched in order to enhance adhesion in the step that follows next. After this, another layer of conductor is added. The previously drilled holes should also be conducted and electrolysis copper plating is one of the processes that can be applied here. In order to balance the pH, it is essential to use an alkaline solution a well add some acidic solutions like copper sulfate.
The circuit's final design is arrived at with the use of photo imaging. Electroplating copper also helps in arriving at the final required thickness. Application of a thin layer of tin or lead solder takes place to allow for the protection of the final circuits. Removal of the unwanted copper is done as it will not be part of the final circuit. Its etching can be carried out using an acidic or alkaline solution.
Obtaining alternative resist can be achieved by use of other compounds that are photosensitive or organic. They can be used in their dry or wet forms. When exposed to ultraviolet light, they become hard.
In order to spread the liquid resist, one can use a silk screen, squeegee, roller or spray. One or both sides can have the liquid on. However, application can also be done to a specific area on the surface. Finer circuits can be produced by use of light.
The formation of multi layer panels is the final stage of this process. The inner cores of the layer are put together. The panels that are assembled together look like a copper foiled book with alternating epoxy sheets.
The book is then placed in a lamination press and high heat and pressure applied to it. The epoxy layers will melt and form a bond. An oven is used to cure the panel. It also undergoes trimming and buffing and then the required holes are finally drilled into it. Summarily, manufacturing of PCB requires a careful and properly calculated procedure in order to achieve the desired results.
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